SLP (Small sized Lead frame Package) products, unlike conventional mold-package products, do not require multi-cavity-mold tools, will be enhanced by using molded array packaging(MAP) technology, which enables molding many chips integrally at the same time.

Features

Requirements for down-sizing of packages, various form/pin numbers, short delivery periods, low costs etc. can be met. High-mix low-volume production is also possible. The products can be applied to communication at high frequency (~12GHz) domain with output (~7W).

Usage

mobile phones, satellite communication, and other general devices such as W-LAN or Bluetooth.